Major investment provides market leading via plugging service Posted on 8/07/14 9:30am
Flintshire based Merlin Circuit Technology have completed the installation and testing of the latest via plugging machine supplied by ITC - the THP35 is the most advanced system currently available, which gives the ability to reliably fill all via types by way of its vacuum head.
This now gives Merlin the in house capability for 100% filling of both through and blind vias to IPC-4761 Type VII offering the PCB designer the option to use ‘Via in Pad’ technology, helping to fan out the latest BGA designs, freeing up space, and potentially removing the need for the costly process of copper filling blind vias, protecting the via plating from harsh environments for space, avionics and military applications.
Chairman Neil Martin stated “This is another demonstration of our commitment to invest in the latest and best technology available to ensure that Merlin Circuit Technology Limited maintains its position as one of Europe’s leading PCB manufacturers”
The investment was supported by the Welsh Government’s Business Innovation programme which can help fund the purchase of capital equipment that supports a technology ‘step-change’ for the business.