Merlin has recently increased its technical capability with the introduction of laser drilling and stacked via processes. This has been achieved with the financial assistance of SMART CYMRU and the European Regional development fund. This technology complements the other high technology processes already being offered by Merlin Circuit Technology at its facility in North Wales.
The laser drilling process has enabled the facility to increase its blind via capability partly due to the increase in aspect ratio that laser drilling allows. Merlin can also process product that requires stacked via technology, which needs to be laser drilled. The vias are also filled, using our updated copper fill processing line.
Tolerances can be found in the latest edition of our capability manual or for more information please contact your account manager or our Technical Director Matthew Beadel e: email@example.com Tel : +44 7831 104368